Smart CMOS Vision Sensors in Deep Sub-0.25um CMOS Technologies. This research project aims to develop a new generation of smart vision sensors featuring on-chip and pixel-level implementation of human vision based algorithms. Built in state-of-the-art deep sub-0.25um CMOS technologies, these imagers will feature extensive in-pixel processing power in contrast to the currently commercially available CMOS vision sensors. This will enable on-chip vision-based decision making but also increased on-c ....Smart CMOS Vision Sensors in Deep Sub-0.25um CMOS Technologies. This research project aims to develop a new generation of smart vision sensors featuring on-chip and pixel-level implementation of human vision based algorithms. Built in state-of-the-art deep sub-0.25um CMOS technologies, these imagers will feature extensive in-pixel processing power in contrast to the currently commercially available CMOS vision sensors. This will enable on-chip vision-based decision making but also increased on-chip image processing. These innovative system-on-chip features will contribute towards the positioning of CMOS imaging technology as the technology of choice for most digital imaging applications, in place of the existing, and so far unchallenged, CCD technology.
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High-speed bidirectional optical interconnects for board-to-board communications. The project will contribute directly to Australia's participation in various ICT industries through the development of innovative solutions and will increase the knowledge and skills base in silicon-photonics. The development of the proposed board-to-board high-speed optical interconnect prototypes will result in R&D outcomes well-matched to the needs and interests of Australian companies; this project will assist ....High-speed bidirectional optical interconnects for board-to-board communications. The project will contribute directly to Australia's participation in various ICT industries through the development of innovative solutions and will increase the knowledge and skills base in silicon-photonics. The development of the proposed board-to-board high-speed optical interconnect prototypes will result in R&D outcomes well-matched to the needs and interests of Australian companies; this project will assist Australia to capitalise on new technology and to become a significant player in the next ICT boom. This project will put Australia at the cutting edge of high-speed interconnect technology and will generate income through licensing the technology and the establishment of spin-off opportunities in both Australia and off-shore.Read moreRead less
Biomimetic Ultra-Thin Compound-Eye Vision Sensor. With the recent advances in microelectronic fabrication technology, it becomes possible today to fabricate paper-thin imaging systems. The proposed research will target the development of such systems to enable the concept of 'stick-on cameras'. Examples of potential applications for this new imaging technology include head-mounted camera patches for rescue workers, smart credit card capable of identifying its user by fingerprint technology, disc ....Biomimetic Ultra-Thin Compound-Eye Vision Sensor. With the recent advances in microelectronic fabrication technology, it becomes possible today to fabricate paper-thin imaging systems. The proposed research will target the development of such systems to enable the concept of 'stick-on cameras'. Examples of potential applications for this new imaging technology include head-mounted camera patches for rescue workers, smart credit card capable of identifying its user by fingerprint technology, discrete monitoring of venues, preventing driver's drowsiness inside a car but also assisting in medical diagnosis and minimally invasive surgery. This leading edge research will enhance the reputation of Australia as a leader in frontier technologies.Read moreRead less
A 3D CMOS Vision Sensor with Pixel Level Analog-to-Digital Converter and Intelligent Processing. The aim of this research project is to build a smart vision sensor using advanced 3D technology. The smart sensor will consist of two vertically stacked levels comprising the vision sensor chip with pixel-level Analog-to-Digital Converter (ADC) and the processing chip for edge and motion detection. The pixel level ADC will be based on new architectures offering improved performance in terms of dynami ....A 3D CMOS Vision Sensor with Pixel Level Analog-to-Digital Converter and Intelligent Processing. The aim of this research project is to build a smart vision sensor using advanced 3D technology. The smart sensor will consist of two vertically stacked levels comprising the vision sensor chip with pixel-level Analog-to-Digital Converter (ADC) and the processing chip for edge and motion detection. The pixel level ADC will be based on new architectures offering improved performance in terms of dynamic range, fill-factor, and signal-to-noise ratio. Both the vision and the processing chips will be realised in standard CMOS technology, which make the smart vision sensor very suitable for low cost consumer electronic applications.Read moreRead less