Linkage Infrastructure, Equipment And Facilities - Grant ID: LE110100164
Funder
Australian Research Council
Funding Amount
$680,000.00
Summary
Dynamic phase behaviour characterisation facility for nanostructured interfaces and solids. This infrastructure will increase our understanding of interfacial phenomena of nanostructured materials over very short periods of time. This new understanding will allow optimisation of the correlation of the chemistry of a material to the properties of that material. The infrastructure will enhance Australia's capabilities in creating new materials relevant to electronics, medicine, the environment and ....Dynamic phase behaviour characterisation facility for nanostructured interfaces and solids. This infrastructure will increase our understanding of interfacial phenomena of nanostructured materials over very short periods of time. This new understanding will allow optimisation of the correlation of the chemistry of a material to the properties of that material. The infrastructure will enhance Australia's capabilities in creating new materials relevant to electronics, medicine, the environment and security technologies.Read moreRead less
Discovery Early Career Researcher Award - Grant ID: DE190101152
Funder
Australian Research Council
Funding Amount
$404,000.00
Summary
Micro/nano-mechanical testing methodologies for interfacial adhesion. This project aims to develop reliable approaches for measuring the toughness of a variety of metal/polymer interfaces integral to contemporary flexible devices. Adhesion between metal thin film conductors and polymer substrates is a critical factor influencing the reliability of the emerging polymer-based flexible electronics. This project will develop new methodologies for understanding the behaviour of these metal/polymer in ....Micro/nano-mechanical testing methodologies for interfacial adhesion. This project aims to develop reliable approaches for measuring the toughness of a variety of metal/polymer interfaces integral to contemporary flexible devices. Adhesion between metal thin film conductors and polymer substrates is a critical factor influencing the reliability of the emerging polymer-based flexible electronics. This project will develop new methodologies for understanding the behaviour of these metal/polymer interfaces. This project will be a crucial enabler to accelerating the development of new flexible microelectronic technologies, from solar panels to electronic skin. This innovation will enable Australia to maintain an important connection to the rapidly-evolving international microelectronic industry and add significant value to Australian manufacturing industries.Read moreRead less
Discovery Early Career Researcher Award - Grant ID: DE210101162
Funder
Australian Research Council
Funding Amount
$395,000.00
Summary
Nanomanipulation of Liquid Metal Interfaces via Polyphenol Assembly. This project aims to explore natural polyphenols to functionalise liquid metal (such as gallium and its alloys) nanoparticles via a coordination-driven self-assembly process. This will advance our current understanding of the interfacial chemistry involved in liquid metal processing toward the synthesis of diverse functional systems. It is expected that such a unique combination will result in hybrid nanostructures possessing s ....Nanomanipulation of Liquid Metal Interfaces via Polyphenol Assembly. This project aims to explore natural polyphenols to functionalise liquid metal (such as gallium and its alloys) nanoparticles via a coordination-driven self-assembly process. This will advance our current understanding of the interfacial chemistry involved in liquid metal processing toward the synthesis of diverse functional systems. It is expected that such a unique combination will result in hybrid nanostructures possessing synergistic properties with potential applications in conductive surface patterning, toxic metal detection and solar steam generation. The developed strategies to manipulate liquid metal interfaces with ubiquitous natural compounds will lay the foundation for future investigations across diverse scientific disciplines.Read moreRead less
Linkage Infrastructure, Equipment And Facilities - Grant ID: LE110100159
Funder
Australian Research Council
Funding Amount
$360,000.00
Summary
National facility for biased target deposition of alloyed nanolayers. This facility will enhance Australia's strengths and capabilities in fabricating structures, with applications in multiple research fields including opto-magneto-electronics, next generation lithium ion batteries and energy nanogenerators. It will enhance Australia's research profile as a leader in nanotechnology.
Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. Thi ....Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. This would revolutionise electronics manufacturing. The project has a high probability of achieving this breakthrough based on unique, world-class expertise in intermetallic compounds and characterisation that has already been established by the international network of Investigators.Read moreRead less
Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include red ....Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include reduced energy costs during electronic manufacture and the development of techniques that will enable sensitive next-generation components to be assembled by removing the need to use elevated temperatures.Read moreRead less