Linkage Infrastructure, Equipment And Facilities - Grant ID: LE0238960
Funder
Australian Research Council
Funding Amount
$940,000.00
Summary
High Performance Semiconductor Micromachining Facility. The purpose of this project is to make available to the Australian semiconductor research community a facility to undertake specialist deposition and etching tasks needed for fabrication of next generation solar cells, microelectronics, optronics, and micro-electromechanical systems. The facility will have the flexibility to allow independent control of major process parameters, allowing development of new fabrication technologies which wi ....High Performance Semiconductor Micromachining Facility. The purpose of this project is to make available to the Australian semiconductor research community a facility to undertake specialist deposition and etching tasks needed for fabrication of next generation solar cells, microelectronics, optronics, and micro-electromechanical systems. The facility will have the flexibility to allow independent control of major process parameters, allowing development of new fabrication technologies which will be generic to a wide range of semiconductor materials. In particular, the facility will be unique in its ability to perform processes at low temperatures, and under conditions that allow optimisation of the deposition and etching processes, without compromising the performance of delicate devices or exceeding the maximum process temperature limitations found in many mainstream semiconductor materials technologies.Read moreRead less
Linkage Infrastructure, Equipment And Facilities - Grant ID: LE0453803
Funder
Australian Research Council
Funding Amount
$535,452.00
Summary
High Performance Optical and Electronic Coatings Facility. The main aim of this project is to establish a state-of-the-art optical and electronic coatings facility for the Australian optoelectronics and nanotechnology research community to develop novel technologies of interest to communications, information technology and nanotechnology industries. The facility will allow the fabrication of a range of active and passive devices including photonic integrated circuits. The facility is f ....High Performance Optical and Electronic Coatings Facility. The main aim of this project is to establish a state-of-the-art optical and electronic coatings facility for the Australian optoelectronics and nanotechnology research community to develop novel technologies of interest to communications, information technology and nanotechnology industries. The facility will allow the fabrication of a range of active and passive devices including photonic integrated circuits. The facility is flexible enough to allow the deposition of a range of dielectric and metal layers with different structural, optical and electrical characteristics of fundamental as well as applied interest. This facility may open up new opportunities to develop microcavities, nanocrystals, tunable lasers and detectors, novel cantilevers for atomic force microscopy.
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Linkage Infrastructure, Equipment And Facilities - Grant ID: LE0347464
Funder
Australian Research Council
Funding Amount
$100,000.00
Summary
Setting up an integrated wirebonding and testing facility for MEMS applications. This project intends to setup an integrated wire bonding and testing facility suitable for Micro electromechanical systems (MEMS) applications. Wire bonding is an essential step for making the contacts of any micro device with external power supply or signal conditioning circuitry. The contact pads for such devices vary in size from 0.050 mm x 0.050 mm to few 100s of micrometers. The proposed facility will be requi ....Setting up an integrated wirebonding and testing facility for MEMS applications. This project intends to setup an integrated wire bonding and testing facility suitable for Micro electromechanical systems (MEMS) applications. Wire bonding is an essential step for making the contacts of any micro device with external power supply or signal conditioning circuitry. The contact pads for such devices vary in size from 0.050 mm x 0.050 mm to few 100s of micrometers. The proposed facility will be required for making contacts either using thermal or ultrasonic methods with complete automatic stages. The electrical contacts are used to drive or monitor MEMS, Polymer micro devices and nano- fluidic systems. This facility will be used for different applications including photonics and communication devices (RMIT), flexi circuits and microwave devices (DSTO) and micro/nano fluidic systems (SUT). This will be the only advanced integrated facility in Victoria, which will have the wire bonding(ball & wedge), die bonding and bond testing facilities together.Read moreRead less