Neuromorphic Sensing and Diagnostics with Carbon: Towards a Biomimetic Nose. Neuromorphic electronics emulates cognitive processes of the brain and like the brain, is capable of extracting features and recognising patterns within data with extremely low energy requirements. Carbon materials are naturally adapted to neuromorphic electronics and uniquely form a compatible interface for sensing molecules in liquid and gaseous media. This project aims to develop a carbon-based neuromorphic electroni ....Neuromorphic Sensing and Diagnostics with Carbon: Towards a Biomimetic Nose. Neuromorphic electronics emulates cognitive processes of the brain and like the brain, is capable of extracting features and recognising patterns within data with extremely low energy requirements. Carbon materials are naturally adapted to neuromorphic electronics and uniquely form a compatible interface for sensing molecules in liquid and gaseous media. This project aims to develop a carbon-based neuromorphic electronic sensing device and couple it with carbon based neuromorphic pattern recognition technology to build an ‘artificial nose’ for improved health and environmental monitoring. Intended outcomes will include a technology for low-cost and rapid diagnostic services.
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High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without se ....High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without seriously degrading the circuit's performance as occurs in current packaging technologies. The project aims to enable cheaper and more energy-efficient applications as wide ranging as wireless HD video, multi-gigabit telecommunications, and black-body passive imaging technologies for security, defence, medical and agricultural applications.Read moreRead less