A new role for vibration analysis in gear wear modelling and prediction. This project aims to improve prediction of the remaining useful life of gears. Gears are widely used in industry and transport. This project aims to integrate the two main methods of gear condition monitoring, vibration and oil analysis, and perform model-based wear prediction with the tribology and dynamic models continually updated on the basis of measured wear debris and vibration. New signal processing tools should allo ....A new role for vibration analysis in gear wear modelling and prediction. This project aims to improve prediction of the remaining useful life of gears. Gears are widely used in industry and transport. This project aims to integrate the two main methods of gear condition monitoring, vibration and oil analysis, and perform model-based wear prediction with the tribology and dynamic models continually updated on the basis of measured wear debris and vibration. New signal processing tools should allow estimation of relatively weak friction forces, previously neglected, as an important prognostic tool. This would allow detailed root cause analysis and prediction of remaining useful life. Improvements in gear prognosis would have safety and economic benefits by eliminating unforeseen catastrophic failures and optimising maintenance schedules.Read moreRead less
Characterisation of soldered and adhesively bonded assemblies in photonic packages. Photonic packaging plays key roles in development of new optical technology. The project aims to establish the theories and techniques for characterising the integrity of soldered and adhesively bonded assemblies for photonic packaging. The critical failure mechanisms will be investigated, and sophisticated life prediction models will be established using artificial neural network (ANN) approaches for reliability ....Characterisation of soldered and adhesively bonded assemblies in photonic packages. Photonic packaging plays key roles in development of new optical technology. The project aims to establish the theories and techniques for characterising the integrity of soldered and adhesively bonded assemblies for photonic packaging. The critical failure mechanisms will be investigated, and sophisticated life prediction models will be established using artificial neural network (ANN) approaches for reliability assessment. The outcomes of the project will fill the gap in the knowledge for characterising failure processes of these assemblies and provide effective methods and easy-to-use guidelines
for reliability evaluation and life prediction of photonic packages, expanding and enhancing Australia's capacity in the areas.
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