Novel Silicon-Based Photonic Devices. Silicon's pre-eminence in high-speed digital electronics does not extend to optoelectronics where the demand is for devices that can generate, guide, detect and process light. However, the properties of silicon are dramatically altered when it is reduced to nanometre dimensions. Advances in the understanding of such effects and in the fabrication and application of nanoscale silicon have provided the prospect of new and innovative Si-based photonic devices, ....Novel Silicon-Based Photonic Devices. Silicon's pre-eminence in high-speed digital electronics does not extend to optoelectronics where the demand is for devices that can generate, guide, detect and process light. However, the properties of silicon are dramatically altered when it is reduced to nanometre dimensions. Advances in the understanding of such effects and in the fabrication and application of nanoscale silicon have provided the prospect of new and innovative Si-based photonic devices, and of fully integrated electronic and photonic functionality. This project aims to extend the understanding of nanoscale silicon and to develop and prototype novel Si-based photonic devices based on this material.Read moreRead less
Asymmetric InP-based structures for high power laser diodes at 1400-1500 nm for pumping optical amplifiers used in communication systems. This project is aimed at obtaining high power, single mode 1400-1500 nm wavelength laser diodes using a novel design of asymmetric InP-based structures. These devices are in great demand for pumping of erbium-doped and Raman amplifiers for powering the next generation of dense wavelength division multiplexing optical networks. The low modal gain (confinement f ....Asymmetric InP-based structures for high power laser diodes at 1400-1500 nm for pumping optical amplifiers used in communication systems. This project is aimed at obtaining high power, single mode 1400-1500 nm wavelength laser diodes using a novel design of asymmetric InP-based structures. These devices are in great demand for pumping of erbium-doped and Raman amplifiers for powering the next generation of dense wavelength division multiplexing optical networks. The low modal gain (confinement factor) of this asymmetric structure is expected to reduce internal losses and hence increase the output power with better thermal dissipation. Single mode could be obtained by careful design in the trade-off between filamentation and threshold current. Ion implantation is also proposed to suppress higher order modes.Read moreRead less
Ion implantation engineered photonic devices for use in highly integrated silicon optoelectronic circuits. This project establishes a collaboration with Canada's leading integrated silicon photonics research group thus tapping into years of valuable experience transferable to Australian-based researchers. The involvement of students as well as early career researchers ensures a new generation of Australian experts in this field. The importance of silicon photonics means that Australia must estab ....Ion implantation engineered photonic devices for use in highly integrated silicon optoelectronic circuits. This project establishes a collaboration with Canada's leading integrated silicon photonics research group thus tapping into years of valuable experience transferable to Australian-based researchers. The involvement of students as well as early career researchers ensures a new generation of Australian experts in this field. The importance of silicon photonics means that Australia must establish a strong research program in the area to maintain its current position as being at the forefront of leading-edge research. This is only possible through collaborations such as that proposed here.Read moreRead less
Linkage Infrastructure, Equipment And Facilities - Grant ID: LE0347464
Funder
Australian Research Council
Funding Amount
$100,000.00
Summary
Setting up an integrated wirebonding and testing facility for MEMS applications. This project intends to setup an integrated wire bonding and testing facility suitable for Micro electromechanical systems (MEMS) applications. Wire bonding is an essential step for making the contacts of any micro device with external power supply or signal conditioning circuitry. The contact pads for such devices vary in size from 0.050 mm x 0.050 mm to few 100s of micrometers. The proposed facility will be requi ....Setting up an integrated wirebonding and testing facility for MEMS applications. This project intends to setup an integrated wire bonding and testing facility suitable for Micro electromechanical systems (MEMS) applications. Wire bonding is an essential step for making the contacts of any micro device with external power supply or signal conditioning circuitry. The contact pads for such devices vary in size from 0.050 mm x 0.050 mm to few 100s of micrometers. The proposed facility will be required for making contacts either using thermal or ultrasonic methods with complete automatic stages. The electrical contacts are used to drive or monitor MEMS, Polymer micro devices and nano- fluidic systems. This facility will be used for different applications including photonics and communication devices (RMIT), flexi circuits and microwave devices (DSTO) and micro/nano fluidic systems (SUT). This will be the only advanced integrated facility in Victoria, which will have the wire bonding(ball & wedge), die bonding and bond testing facilities together.Read moreRead less
Monolithic Integration of Silicon Waveguide and Ge1-xSix Photodetector on Silicon-on Insulator Platform for Intra-chip Optical Interconnect. Photonics has become the major technology underpinning the communication and storage of data. As photonics advances applications are emerging which demand components be manufactured cheaply in the manner achieved by the electronics industry in the silicon chip. Silicon is now emerging as an important photonic material and devices can benefit from inexpensiv ....Monolithic Integration of Silicon Waveguide and Ge1-xSix Photodetector on Silicon-on Insulator Platform for Intra-chip Optical Interconnect. Photonics has become the major technology underpinning the communication and storage of data. As photonics advances applications are emerging which demand components be manufactured cheaply in the manner achieved by the electronics industry in the silicon chip. Silicon is now emerging as an important photonic material and devices can benefit from inexpensive processing methods developed for electronics. This project aims to capture key intellectual property for monolithically integrating key photonic components onto a silicon platform. The project can bring social and commercial benefits to Australia such as high-level research and training in nanotechnology as well as opportunities for commercialisation in niche markets.Read moreRead less