Innovative Double Patterning Strategies for Integrated Circuit Manufacture. The global computer chips industry is predicted to be worth in excess of 1.5 trillion USD by 2030. Despite its success, the industry is under threat due to rising costs of manufacture of the latest chips, in large part because of the complexity of the manufacturing process. This project aims to introduce new polymers for production of computer chips and, in collaboration with our industry partner, develop new methods of ....Innovative Double Patterning Strategies for Integrated Circuit Manufacture. The global computer chips industry is predicted to be worth in excess of 1.5 trillion USD by 2030. Despite its success, the industry is under threat due to rising costs of manufacture of the latest chips, in large part because of the complexity of the manufacturing process. This project aims to introduce new polymers for production of computer chips and, in collaboration with our industry partner, develop new methods of manufacture to enable the next generation of chips. The project has potential to generate valuable intellectual property, support new processes and equipment for our partners, and help train the next generation of Australian researchers in the growing field of polymeric nanotechnology. Read moreRead less
Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include red ....Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include reduced energy costs during electronic manufacture and the development of techniques that will enable sensitive next-generation components to be assembled by removing the need to use elevated temperatures.Read moreRead less
Integrated Cooling Enhancement Technology for Power Electronics. This project aims to develop an unprecedented integrated cooling enhancement technology (IceTech) for silicon carbide on silicon power electronics. IceTech represents a radical departure from current failure-prone packaging solutions. The project aims to elucidate the fundamental interactions between magnetism, heat and mass transfer and apply them to cooling. In partnership with SPTS Technologies, the project then aims to develop ....Integrated Cooling Enhancement Technology for Power Electronics. This project aims to develop an unprecedented integrated cooling enhancement technology (IceTech) for silicon carbide on silicon power electronics. IceTech represents a radical departure from current failure-prone packaging solutions. The project aims to elucidate the fundamental interactions between magnetism, heat and mass transfer and apply them to cooling. In partnership with SPTS Technologies, the project then aims to develop fabrication processes for integrating microchannels and highly sensitive integrated silicon carbide temperature sensors into a chip. This novel fabrication technology allows for the implementation of the revolutionary enhanced cooling concept using two-phase flow with magnetic liquid plugs.Read moreRead less
Silicon-Carbide Switches for Post-Silicon Efficiency of Power Electronics. The aim of this project is to create a prototype of a silicon carbide (SiC)-based power-electronic switch for improved energy efficiency and reduced size of power-electronic circuits, well beyond the theoretical limits of silicon technology. Until very recently, the dominant controlled switch in electronics could only be implemented as a silicon transistor. A new method of electronic passivation of SiC surfaces has enable ....Silicon-Carbide Switches for Post-Silicon Efficiency of Power Electronics. The aim of this project is to create a prototype of a silicon carbide (SiC)-based power-electronic switch for improved energy efficiency and reduced size of power-electronic circuits, well beyond the theoretical limits of silicon technology. Until very recently, the dominant controlled switch in electronics could only be implemented as a silicon transistor. A new method of electronic passivation of SiC surfaces has enabled the recent commercialisation of SiC transistors. It is expected that the material advantages of SiC can be fully exploited by a new device structure and a new fabrication process.Read moreRead less