Design automation for secure, reliable and energy efficient embedded processors. This project seeks to create a methodology to design and generate processors which are both secure, reliable and energy efficient for deployment in Internet of Things (IoT) systems, which require little on-going maintenance. In such systems, both security and reliability are paramount, particularly in medical devices, control devices in critical machinery, financial transactions and automotive electronics. The proje ....Design automation for secure, reliable and energy efficient embedded processors. This project seeks to create a methodology to design and generate processors which are both secure, reliable and energy efficient for deployment in Internet of Things (IoT) systems, which require little on-going maintenance. In such systems, both security and reliability are paramount, particularly in medical devices, control devices in critical machinery, financial transactions and automotive electronics. The project will use an open RISC-V processor which is sufficiently flexible to function as a base processor, with a myriad of tools such as compilers and debuggers available. Reliable computing machinery will enable systems to work in hostile environments and be functionally correct for longer.Read moreRead less
Photonic chip inertial movement sensors. This project aims to create a new class of optical inertial movement sensors using integrated photonic chip technology. By replacing optical fibre coils with compact waveguides, integrating light sources on-chip and by harnessing smart sensing approaches, we intend to reduce the required power from watts to milliwatts and reduce the dimensions from meters to centimetres. The expected project outcomes are sensors with military grade precision but with the ....Photonic chip inertial movement sensors. This project aims to create a new class of optical inertial movement sensors using integrated photonic chip technology. By replacing optical fibre coils with compact waveguides, integrating light sources on-chip and by harnessing smart sensing approaches, we intend to reduce the required power from watts to milliwatts and reduce the dimensions from meters to centimetres. The expected project outcomes are sensors with military grade precision but with the size, cost and manufacturability of consumer electronics. This technology will fill a strategic gap in the movement sensor market enabling applications ranging from robotic infrastructure monitoring, manufacture and surgery to guiding satellites and other space craft.Read moreRead less
Developing hole spin quantum bits in industrially fabricated silicon chips. This is a joint proposal to combine IMEC’s technology and facilities for silicon chip fabrication with UNSW’s expertise in quantum devices to optimise the design and fabrication techniques used to manufacture silicon based hole spin qubits on an industrial scale in a full 300mm wafer fabrication line. IMEC is a world-leading research and innovation hub in nanoelectronics and digital technologies, with a €1billion semico ....Developing hole spin quantum bits in industrially fabricated silicon chips. This is a joint proposal to combine IMEC’s technology and facilities for silicon chip fabrication with UNSW’s expertise in quantum devices to optimise the design and fabrication techniques used to manufacture silicon based hole spin qubits on an industrial scale in a full 300mm wafer fabrication line. IMEC is a world-leading research and innovation hub in nanoelectronics and digital technologies, with a €1billion semiconductor chip fabrication facility, while UNSW has unparalleled cryogenic equipment and theoretical expertise for the study of electrons and holes in semiconductor devices. The outcomes will open up new routes to spin-based quantum computing based on holes. Read moreRead less
High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without se ....High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without seriously degrading the circuit's performance as occurs in current packaging technologies. The project aims to enable cheaper and more energy-efficient applications as wide ranging as wireless HD video, multi-gigabit telecommunications, and black-body passive imaging technologies for security, defence, medical and agricultural applications.Read moreRead less
Digitally Assisted Power Amplifier Design with Enhanced Energy Efficiency. The project aims to advance design techniques for power amplifiers operating in the recently allocated spectrum for 5G New Radio, from approximately 24 GHz to 52 GHz. The intended outcome is a compact and high efficiency transmitter using digitally assisted power amplifier design techniques in low-cost Complementary Metal–Oxide–Semiconductor (CMOS) technology. Such innovation will have significant impacts on our daily lif ....Digitally Assisted Power Amplifier Design with Enhanced Energy Efficiency. The project aims to advance design techniques for power amplifiers operating in the recently allocated spectrum for 5G New Radio, from approximately 24 GHz to 52 GHz. The intended outcome is a compact and high efficiency transmitter using digitally assisted power amplifier design techniques in low-cost Complementary Metal–Oxide–Semiconductor (CMOS) technology. Such innovation will have significant impacts on our daily life, as it will build the hardware foundation for the next generation of wireless systems. Consequently, various emerging applications such as virtual/augmented reality will be supported, maintaining national leadership in the development of wireless technology, and providing economic benefits for Australian industries.Read moreRead less
Wireless Integrated Circuits for the Era of 6G: System-in-a-Package. The aim of this project is to build a hardware foundation for future wireless integrated circuits, using a combination of silicon and compound semiconductor technologies. The project will generate knowledge for circuit design and system integration to pivot towards the engineering of emerging 6G technology. Expected outcomes include a transceiver-in-package using multiple semiconductor technologies and the development of sovere ....Wireless Integrated Circuits for the Era of 6G: System-in-a-Package. The aim of this project is to build a hardware foundation for future wireless integrated circuits, using a combination of silicon and compound semiconductor technologies. The project will generate knowledge for circuit design and system integration to pivot towards the engineering of emerging 6G technology. Expected outcomes include a transceiver-in-package using multiple semiconductor technologies and the development of sovereign design capabilities. The results will constitute an important step towards implementing 6G. Benefits for Australia include the development of early career workers, generation of intellectual property, and securing social and economic benefits for Australians through application of this next-generation technology.Read moreRead less
A novel platform-technology for long-term subcutaneous neurophysiology. This project aims to develop a novel miniature device for subcutaneous and tetherless brain sensing. It addresses the lack of a device solution for brain-sensing that combines ultra-long-term reliable sensing capability and small dimensions for minimally-invasive procedures. We achieve this through our novel electrode architecture that significantly enhances the quality and reliability of recorded brain signals. We introduce ....A novel platform-technology for long-term subcutaneous neurophysiology. This project aims to develop a novel miniature device for subcutaneous and tetherless brain sensing. It addresses the lack of a device solution for brain-sensing that combines ultra-long-term reliable sensing capability and small dimensions for minimally-invasive procedures. We achieve this through our novel electrode architecture that significantly enhances the quality and reliability of recorded brain signals. We introduce a platform technology designed for subscalp anatomy with future use in various brain-machine interfacing applications relying on reliable, long-term and easy-to-implant systems. This project's device manufacturing, training, and intellectual property are expected to strengthen Australia's position in bioelectronics.Read moreRead less
Beyond the Ferroelectric Field Effect Transistors. The von Neumann paradigm is the foundation of modern computing systems, which are based on the data exchange between central processing unit (CPU) and memory. The physical separation between the CPU and memory will cause von Neumann bottleneck – a memory wall to limit the data processing speed for contextually intelligent applications. This project aims to develop a novel ferroelectric field effect transistor that integrates a ferroelectric mat ....Beyond the Ferroelectric Field Effect Transistors. The von Neumann paradigm is the foundation of modern computing systems, which are based on the data exchange between central processing unit (CPU) and memory. The physical separation between the CPU and memory will cause von Neumann bottleneck – a memory wall to limit the data processing speed for contextually intelligent applications. This project aims to develop a novel ferroelectric field effect transistor that integrates a ferroelectric material into a semiconductor transistor structure to merge logic and memory functionalities in a single-device level. This will solve the memory wall problem while provide low power, high speed, high density and long data retention time for future logic-in-memory and data centric computing paradigms.Read moreRead less
High performance metal oxide inks for printable memory arrays . This project aims to develop next generation printable memory devices with low cost and excellent stability. The goal will be achieved by developing a new class of metal oxide nanomaterials based inks and large scale printing technology, through optimizing the synthesis, printing process and electrode configuration. The expected outcomes will be new electronic materials for a wide range of end uses in flexible electronics, significa ....High performance metal oxide inks for printable memory arrays . This project aims to develop next generation printable memory devices with low cost and excellent stability. The goal will be achieved by developing a new class of metal oxide nanomaterials based inks and large scale printing technology, through optimizing the synthesis, printing process and electrode configuration. The expected outcomes will be new electronic materials for a wide range of end uses in flexible electronics, significant advances in energy efficient data storage devices, and commercialisation of the technology to Australian industries.Read moreRead less