Integrated on-chip force and displacement sensors for high-speed atomic force microscopy of ultimate sensitivity. This project aims to develop next generation atomic force microscopy systems based on a novel interferometric method for on-chip force and displacement sensing. The proposed sensitivity improvement of two orders of magnitude over the present state-of-the-art will provide a disruptive innovation for various present and future nanotechnologies.
Towards a unified technology platform for sensing in liquids. Towards a unified technology platform for sensing in liquids. This project aims to use a new sensing platform for hydrocarbon monitoring in water to evolve optical on-chip position sensing of suspended micro-structures. Microelectromechanical systems dominate the world in sensing technology; they are common in smartphone, automotive, aerospace, and military applications. However, this multibillion dollar industry has failed to make ch ....Towards a unified technology platform for sensing in liquids. Towards a unified technology platform for sensing in liquids. This project aims to use a new sensing platform for hydrocarbon monitoring in water to evolve optical on-chip position sensing of suspended micro-structures. Microelectromechanical systems dominate the world in sensing technology; they are common in smartphone, automotive, aerospace, and military applications. However, this multibillion dollar industry has failed to make chem/bio sensing profitable, mostly due to the absence of a robust and compact read-out technology for sensing in liquids. This project is expected to lead to a unified parallel sensing platform of ultimate sensitivity delivering aqueous sensing for wide ranging applications and markets.Read moreRead less
Characterisation of soldered and adhesively bonded assemblies in photonic packages. Photonic packaging plays key roles in development of new optical technology. The project aims to establish the theories and techniques for characterising the integrity of soldered and adhesively bonded assemblies for photonic packaging. The critical failure mechanisms will be investigated, and sophisticated life prediction models will be established using artificial neural network (ANN) approaches for reliability ....Characterisation of soldered and adhesively bonded assemblies in photonic packages. Photonic packaging plays key roles in development of new optical technology. The project aims to establish the theories and techniques for characterising the integrity of soldered and adhesively bonded assemblies for photonic packaging. The critical failure mechanisms will be investigated, and sophisticated life prediction models will be established using artificial neural network (ANN) approaches for reliability assessment. The outcomes of the project will fill the gap in the knowledge for characterising failure processes of these assemblies and provide effective methods and easy-to-use guidelines
for reliability evaluation and life prediction of photonic packages, expanding and enhancing Australia's capacity in the areas.
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On-chip spectroscopy and hyperspectral imaging for remote environments. On-chip spectroscopy and hyperspectral imaging for remote environments. This project aims to investigate techniques and materials for building optical spectrometers based on micromachines, usable in portable ground-based and drone-mounted applications in remote environments. Optical spectroscopy is now an accepted technique for materials detection and analysis. The advent of low-cost drone aircraft makes the potential applic ....On-chip spectroscopy and hyperspectral imaging for remote environments. On-chip spectroscopy and hyperspectral imaging for remote environments. This project aims to investigate techniques and materials for building optical spectrometers based on micromachines, usable in portable ground-based and drone-mounted applications in remote environments. Optical spectroscopy is now an accepted technique for materials detection and analysis. The advent of low-cost drone aircraft makes the potential applications of spectroscopy in an imaging form immense. The project expects the resulting low-cost and highly portable technology will transform Australian industry, including securing Australia’s food supply by improving farming practices, aiding mineral exploration, and enhancing capabilities for monitoring Australia’s coastline.Read moreRead less
An investigation of novel Microelectromechanical Systems based technologies for visible/near infra-red spectroscopic imaging. This project will develop new spectroscopic imaging technologies that make possible low-cost, portable instruments with enhanced performance, and that enable new applications. Examples include on-farm precision agriculture, skin cancer detection, food security and processing, airport security, pollution monitoring and industrial process control.